Preparation and characterization of coated nanoscale Cu/SiCp composite particles

Ceramics International

Volumn 30, Issue 3, 2004, Pages 401-404

  Zhang, Rui ^a,b   Gao, Lian ^a   Guo, Jingkun ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

^b ZHENGZHOU UNIVERSITY   (China)

Author keywords

A. Sintering; B. Nanocomposites; D. SiC

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COATED MATERIALS; COATING TECHNIQUES; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; MASS SPECTROMETRY; NANOSTRUCTURED MATERIALS; OXIDATION; SCANNING ELECTRON MICROSCOPY; SHELLS (STRUCTURES); SILICON CARBIDE; SINTERING; THERMOGRAVIMETRIC ANALYSIS; X RAY DIFFRACTION;

COATED PARTICLES; CORE-SHELL STRUCTURES;

COMPOSITE MATERIALS;

EID: 1542380046     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0272-8842(03)00123-8     Document Type: Article

References (19)

1. Kennedy F.E., Balbahadur A.C., Lashmore D.S. The friction and wear of Cu-based silicon carbide particulate metal matrix composites for brake applications. Wear. 203-204:1997;715-721.
2. Groza J.R., Gibeling J.C. Principles of particle selection for dispersion-strengthened copper. Mater. Sci. Eng. A. 171:1993;115-125.
3. Tummala R.R. Ceramic and glass-creamic packaging in the 1990s. J. Am. Ceram. Soc. 74(5):1991;895-908.
4. Delannay F., Froyen L., Deruyttere A. Review, The wetting of solids by molten metals and its relation to the preparation of metal-matrix composites. J. Mater. Sci. 22:1987;1-6.
5. Pelleg J., Ruhr M., Ganor M. Control of the reaction at the fibre-matrix interface in a Cu/SiC metal matrix composite by modifying the matrix with 2.5 wt.% Fe. Mater. Sci. Eng. A. 212:1996;139-148.
6. Chang S.Y., Lin S.J. Fabrication of SiCw reinforced copper matrix composite by electroless copper plating. Scripta Mater. 35(2):1996;225-231.
7. Yih P., Chung D.D.L. A comparative study of the coated filler method and the admixture method of powder metallurgy for making metal-matrix composites. J. Mater. Sci. 32(11):1997;2873-2882.
8. Yih P., Chung D.D.L. Silicon carbide whisker copper-matrix composites fabricated by hot pressing copper coated whiskers. J. Mater. Sci. 31:1996;399-406.
9. Lee Y.F., Lee S.L., Chuang C.L., Lin J.C. Effect of SiCp reinforcement by electroless copper plating on properties of Cu/SiCp composites. Powder Metall. 42(2):1999;147-152.
10. Gleiter H. Materials with ultrafine microstructures. retrospectives and perspectives Nanostructured Mater. 1:1992;1-19.
11. Cammarata R.C. Mechanical properties of nanocomposite thin films. Thin Solid Films. 240:1994;82-87.
12. Bever M.B. Encyclopedia of Materials Sicence and Engineering. 1986;Pergamon Press, Massachusetts Institute of Technology, USA, Cambridge, Massachusetts.
13. Buelens C., Celis J.P., Roos J.R. Electrochemical aspects of the codeposition of gold and copper with inert particles. J. Appl. Electrochem. 13:1983;541-548.
14. D.E. Jech, J.L. Sepulveda, A.B. Traversone, US patent, US005686676A, 11 November 1997.
15. Reser M.K. Phase Diagrams for Ceramists. 1969;The American Ceramic Society, Columbus, OH.
16. Reser M.K. Phase Diagrams for Ceramists, 3rd Edition. 1974;The American Ceramic Society, Columbus, OH.
17. An Z., Ohi A., Hirai M., Kusaka M., Iwami M. Study of the reaction at Cu/3C-SiC interface. Surf. Sci. 493:2001;182-187.
18. Park J.S., Landry K., Perepezko J.H. Kinetic control of silicon carbide/metal reactions. Mater. Sci. Eng. A. 259:1999;279-286.
19. Warren R., Andersson C.-H. Silicon carbide fibres and their potential for use in composite materials, Part II. Composites. 15(2):1984;101-111.