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Volumn 25, Issue 2, 2004, Pages 1-4
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Editorial: Managing electronics thermal management
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRONICS PACKAGING;
ENGINEERS;
HEAT TRANSFER COEFFICIENTS;
INDUSTRIAL MANAGEMENT;
MICROELECTROMECHANICAL DEVICES;
MICROELECTRONIC PROCESSING;
MULTICHIP MODULES;
SEMICONDUCTOR DEVICE MANUFACTURE;
TRANSISTORS;
SCIENTISTS;
SEMICONDUCTOR ELECTRONICS;
THERMAL ENGINEERS;
THERMAL MANAGEMENT;
HEAT CONVECTION;
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EID: 1542366643
PISSN: 01457632
EISSN: 15210537
Source Type: Journal
DOI: 10.1080/01457630490275944 Document Type: Article |
Times cited : (9)
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References (4)
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