New substrates for MOEMS

Proceedings of IEEE Sensors

Volumn 1, Issue 1, 2002, Pages 607-612

  Reiche, M ^a   Hiller, E ^b   Stolze, D ^b  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b CiS Institut fur Mikrosensorik gGmbH   (Germany)

Author keywords

Hydrophobic wafer bonding; MOEMS; Photodetectors

Indexed keywords

BONDING; DIODES; ELECTRIC CONDUCTIVITY; ELECTRIC POTENTIAL; HYDROPHILICITY; HYDROPHOBICITY; INTERFACES (MATERIALS); PHOTOCURRENTS; PHOTODETECTORS; SILICON WAFERS;

HYDROPHOBIC WAFER BONDING (HWB); MOEMS; PSEUDO-EPITAXIAL WAFERS (PEW);

MICROELECTROMECHANICAL DEVICES;

EID: 1542361441     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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5. Tong, Q.-Y. and Gösele, U., Semiconductor wafer bonding: science and technology, Wiley-Interscience, New York (1999)
6. Reiche, M., et al., Cryst. Res. Technol., 35, 807 (2000)
7. CIS Institut für Mikrosensorik, Erfurt, product information SFD3.7 - single photodiode