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Volumn , Issue , 1998, Pages 429-434

Selective Wet-Etch of Silicon Nitride Passivation Layers

Author keywords

[No Author keywords available]

Indexed keywords

MECHANICAL MICROPROBING; VOLTAGE CONTRAST;

EID: 1542360770     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (2)

References (12)
  • 1
    • 0022756371 scopus 로고
    • Characterization of silicon oxynitride films deposited by plasma enhanced CVD
    • Claassen, et al.: Characterization of silicon oxynitride films deposited by plasma enhanced CVD; J.Electrochem. Soc. 133 (1986), 1458
    • (1986) J. Electrochem. Soc. , vol.133 , pp. 1458
    • Claassen1
  • 2
    • 84888949094 scopus 로고
    • A procedure for the non destructive removal of glassivation from integrated circuits
    • J.Abott : A procedure for the non destructive removal of glassivation from integrated circuits; Proc. of the ISTFA (1986), 113
    • (1986) Proc. of the ISTFA , pp. 113
    • Abott, J.1
  • 3
    • 84888958221 scopus 로고
    • Failure analysis applications of plasma
    • Tomasi, et al.: Failure analysis applications of plasma ; Proc. of the ISTFA (1987) 35
    • (1987) Proc. of the ISTFA , pp. 35
    • Tomasi1
  • 4
    • 0026836339 scopus 로고
    • Selective removal of dielectrics from integrated circuits for Electron Beam Probing
    • W. Baerg, et al.: Selective removal of dielectrics from integrated circuits for Electron Beam Probing; Proc. of the IRPS (1992) 320
    • (1992) Proc. of the IRPS , pp. 320
    • Baerg, W.1
  • 5
    • 0027186749 scopus 로고
    • A mechanism for gate-oxide damage in non-uniform plasmas
    • S.Fang, et al.: A mechanism for gate-oxide damage in non-uniform plasmas; Proc. of the IRPS (1993) 13
    • (1993) Proc. of the IRPS , pp. 13
    • Fang, S.1
  • 8
    • 1542284484 scopus 로고    scopus 로고
    • A review of wet etch formulas for silicon semiconductor failure analysis
    • T.W. Lee : A review of wet etch formulas for silicon semiconductor failure analysis; Proc. of the ISTFA (1996) 319
    • (1996) Proc. of the ISTFA , pp. 319
    • Lee, T.W.1
  • 10
    • 84888956150 scopus 로고
    • 2 composites in HF/Glycerol mixtures
    • 2 composites in HF/Glycerol mixtures; J.Electrochem. Soc., vol.124 (1977), no. 6, 917
    • (1977) J. Electrochem. Soc. , vol.124 , Issue.6 , pp. 917
    • Deckert, C.A.1
  • 11
    • 84888949672 scopus 로고
    • Wet etch of nitride passivation layers: An effective alternative to plasma-etch for failure analysis
    • P. Malberti, M.Ciappa, et al.:Wet etch of nitride passivation layers: an effective alternative to plasma-etch for failure analysis ; Proc. of the ISTFA (1994) 157
    • (1994) Proc. of the ISTFA , pp. 157
    • Malberti, P.1    Ciappa, M.2
  • 12
    • 84888938088 scopus 로고    scopus 로고
    • Semicon Etch Technologies, P.O. Box 2631, CH-6051 Bellinzona, Switzerland
    • Semicon Etch Technologies, P.O. Box 2631, CH-6051 Bellinzona, Switzerland


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.