Materials Analysis and Process Monitoring in MegaFabs

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2002, Pages 69-75

  Tracy, Bryan ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MATERIALS ANALYSIS; PROCESS MONITORING;

ELECTROMIGRATION; METALLIZING; MICROPROCESSOR CHIPS; PERMITTIVITY; PHYSICAL VAPOR DEPOSITION; PROCESS CONTROL; SCANNING ELECTRON MICROSCOPY; SPUTTERING; TRANSMISSION ELECTRON MICROSCOPY;

MATERIALS SCIENCE;

EID: 1542360124     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Figure 1 courtesy of Alain Diebold, SEMATECH.
2. Figure 2 courtesy of Rigaku Corporation.
3. Unpublished research, Bryan Tracy and John McIntosh, FEI Corporation, 2002.
4. M. Nakagawa and R. Dunne, J of the Japanese Society for Electron Microscopy, 51(1), 53-57 (2002).
5. J. Mardinly: Microscopy and Microanalysis Meeting, Long Beach, Ca, USA, 2001.
6. H. Stegmann, H. J. Engelmann, E. Zschech: Microelectron. Eng (2002) in press.
7. T. Poon, J. Ma, M. Naik, B. Tang, M. Yu, C. Lang, I. Lou, D. Sugiarto, P. Lee, W. Yau, D. Cheung, VMIC proceedings, Sept 7-9, page 190-192, 1999.
8. International Technology Roadmap for Semiconductors, Semiconductor Industry Association, 2001.
9. Figures 8 and 9 courtesy Hitachi High-Technologies, Technical Data, SEM 100.
10. E. Zschech, E. Langer, H. J. Engelmann, K. Dittmar, EMAS, Strasbourg, Sym O, 2002