SCOPUS 정보 검색 플랫폼

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1999, Pages 311-316

In-situ Dual Beam (FIBSEM) Techniques for Probe Pad Deposition and Dielectric Integrity Inspection in 0.2 μm Technology DRAM Single Cells

(2) Zimmermann, Gunnar a Chapman, Richard a

a White Oak Semiconductor (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC INTEGRITY INSPECTION; ELECTRON LOCALIZATION; FOCUSED ION BEAM (FIB) SYSTEMS; PROBE PAD DEPOSITION;

DIELECTRIC PROPERTIES; ELECTRON BEAMS; FAILURE ANALYSIS; ION BEAMS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICES; SILICA; TRANSMISSION ELECTRON MICROSCOPY;

DYNAMIC RANDOM ACCESS STORAGE;

EID: 1542348527 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (5)

References (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.