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Volumn , Issue , 1999, Pages 311-316
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In-situ Dual Beam (FIBSEM) Techniques for Probe Pad Deposition and Dielectric Integrity Inspection in 0.2 μm Technology DRAM Single Cells
a
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Author keywords
[No Author keywords available]
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Indexed keywords
DIELECTRIC INTEGRITY INSPECTION;
ELECTRON LOCALIZATION;
FOCUSED ION BEAM (FIB) SYSTEMS;
PROBE PAD DEPOSITION;
DIELECTRIC PROPERTIES;
ELECTRON BEAMS;
FAILURE ANALYSIS;
ION BEAMS;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTOR DEVICES;
SILICA;
TRANSMISSION ELECTRON MICROSCOPY;
DYNAMIC RANDOM ACCESS STORAGE;
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EID: 1542348527
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (5)
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References (8)
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