Integrated Circuit Device Repair using FIB system: Tips, Tricks, and Strategies

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1999, Pages 247-254

  Hooghan, K N ^a   Wills, K S ^b   Rodriguez, P A ^c   O'Connell, S ^d  

^a NOKIA RESEARCH CENTER   (United States)

^b TEXAS INSTRUMENTS   (United States)

^c Reactive Beam Technology   (United States)

^d Cyrix Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BEAM CURRENTS; FOCUSED ION BEAMS (FIB);

COMPUTER AIDED DESIGN; ELECTRON MULTIPLIERS; ION BEAMS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THRESHOLD VOLTAGE;

INTEGRATED CIRCUITS;

EID: 1542300934     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

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2. Liquid Metal Ion sources and Limits on Focused Ion Beam Imaging Resolution, Jon Orloff, Course notes, The Essentials of Focused Ion Beam Technology, University of Maryland, October, 5,6 1997.
3. Focused Ion Beam Applications, Peter Carleson, Metro Microscopy Meeting, Paramus N.J. 4/27/99.
4. K. S. Wills and S. V. Pabbisetty, "Microsurgery Technology for the Semiconductor Industry," in Electronic Failure Analysis, desk reference, 1998, pp. 227-276.
5. A. N. Campbell and J. M. Soden, "Voltage Contrast in the FIB as a Failure Analysis Tool," in Electronic Failure Analysis, desk reference, 1998, pp. 129-135.
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7. "Integrated Circuit Modification", Peter Carleson, Course notes, The Essentials of Focused Ion Beam Technology, University of Maryland, October, 5,6 1997.
8. Numerous discussions, experiments and notes compiled while working @ Beam-It Inc. Carrolton, TX, during the authors tenure there carrying out contract FIB work.
9. K. Van Doorselear, R. Young, N. Dawes, "Golden Devices II: Alchemy in the .35μ Era," Proceedings, ISTFA, '96, pp.27-35.
10. Private discussion with John Walker Ph.D., FEI Europe.
11. R.A.Lee, T.R. Lundquist, "Low Resistivity Depositions Within High Aspect Ratio Holes," Proceedings ISTFA' '96, pp. 85-88.
12. Applications note, "Focused Ion Beam Applications Using Enhanced Etch," John. F. Walker, FEI Europe, Ltd.
13. K. Van Doorselear, M. Van Den Reeck, L. Van Den Bempt, R. Young, J. Whitney, " How to prepare Golden Devices Using Lesser Materials," Proceedings, ISTFA, '93, pp.405-414.
14. K. Van Doorselear, L. Van Den Bempt, "How To Use Cu-Plating for Low-Ohmic Long Distance FIB Connections," Proceedings, ISTFA, '94, pp. 397-405.
15. http://www.knights.com