Die Backside FIB Preparation for Identification and Characterization of Metal Voids

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1999, Pages 317-325

  Campbell, Ann N ^a   Filter, William F ^a   Antoniou, Nicholas ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b Micrion Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FOCUSED ION BEAM (FIB) SYSTEMS; METAL VOIDS;

BACKSCATTERING; CHARACTERIZATION; FAILURE ANALYSIS; FLIP CHIP DEVICES; ION BEAMS; REPAIR; SCANNING ELECTRON MICROSCOPY;

INTEGRATED CIRCUITS;

EID: 1542300923     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. nd International Symp. for Testing and Failure Analysis, p. 381, 18-22 Nov. 1996
2. th International Symp. for Testing and Failure Analysis, p. 455, 15 - 19 Nov. 1998
3. N. Antoniou, Solid State Technology, p. 63, Dec. 1998
4. R. H. Livengood and V. R. Rao, Semiconductor International, p. 111, March 1998
5. nd edition, ed. J. I. Goldstein et al, p. 220, Plenum Press, New York, 1992
6. th International Symp. for Testing and Failure Analysis, p. 439, 13 - 18 Nov. 1994
7. th International Symp. for Testing and Failure Analysis, p. 67, 15 - 19 Nov. 1998