A New Deprocessing Technique by Selective Wet-Etch of Passivation and Inter Metal Dielectric Layers for Submicron Devices

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2001, Pages 319-322

  Khiam, Oh Chong ^a   Min, Wu Zong ^a   Redkar, Shailesh ^a  

^a CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DEPROCESSING TECHNIQUES; INTER METAL DIELECTRIC (IMD) LAYERS; WET ETCHING;

DIELECTRIC MATERIALS; DRY ETCHING; FAILURE ANALYSIS; METALLIZING; PASSIVATION; PLASMA ETCHING; POLYMERS; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICES;

INTEGRATED CIRCUITS;

EID: 1542270671     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. th Edition, pp.233-242, ASM, Materials Park, Ohio, 1999.
2. th Edition, pp.243-252, ASM, Materials Park, Ohio, 1999.
3. th International Symposium for Testing and failure Analysis, pp.429-434, November 1998.
4. rd Edition, pp.121-124, ASM, Materials Park, Ohio, 1993.
5. David S. Kiefer, "Reactive ion etch recipes for failure analysis, " Microelectronic Failure Analysis Desk Reference, pp.125-130, ASM, Materials Park, Ohio, 1993.