Fine pattern transfer by nanocasting lithography

Microelectronic Engineering

Volumn 78-79, Issue 1-4, 2005, Pages 641-646

  Hirai, Yoshihiko ^a   Yoshikawa, Takashi ^a   Morimatsu, Masatoshi ^a   Nakajima, Masaki ^a   Kawata, Hiroaki ^a  

^a Osaka Prefecture University   (Japan)

Author keywords

Adhesion; Casting; Lithography; Nanoimprint; Polymer; Resin

Indexed keywords

ADHESION; ADHESIVES; ASPECT RATIO; CASTING; DRY ETCHING; ELASTOMERS; MOLDS; NANOTECHNOLOGY; ORGANIC POLYMERS; POLYCARBONATES; POLYMETHYL METHACRYLATES; RESINS; SCANNING ELECTRON MICROSCOPY; SPIN COATING;

ADHESIVE RESINS; BIODEGRADABLE POLYMERS; FINE PATTERN TRANSFER; NANOIMPRINT LITHOGRAPHY (NIL);

LITHOGRAPHY;

EID: 14944363268     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.12.080     Document Type: Conference Paper

References (4)

1. S.Y. Chou, P.R. Krauss, and P.J. Renstrom Appl. Phys. Lett. 67 1995 3114
2. M. Colburn, S. Johnson, M. Stewart, S. Damle, T. Bailey, B. Choi, M. Wedlake, T. Michaelson, S.V. Sreenivasan, J. Ekerdt, and C.G. Willson Proc. SPIE 3676 1999
3. Y. Hirai, S. Yoshida, A. Okamoto, Y. Tanaka, M. Endo, S. Irie, H. Nakagawa, and M. Sasago J. Photopolym. Sci. Technol. 14 2001 457
4. N. Yamazaki, Y. Kurashima, H. Hiroshima, M. Komuro, Ext. Abs. of the 51th spring meeting of Jpn. Soc. Appl. Phys. Tokyo, 30p-G-11, 2004