Microhardness and young's modulus of a bonding resin cured with different curing units

Dental Materials Journal

Volumn 23, Issue 4, 2004, Pages 457-466

  Yamauti, Monica ^a   Nikaido, Toru ^a   Ikeda, Masaomi ^a   Otsuki, Masayuki ^a   Tagami, Junji ^a  

^a TOKYO MEDICAL AND DENTAL UNIVERSITY   (Japan)

Author keywords

Bonding resin; Microhardness; Nanoindentation test

Indexed keywords

HALIDE; HALOGEN; RESIN; SILICON DIOXIDE; TUNGSTEN;

ARTICLE; HARDNESS; LIGHT; LIGHT EMITTING DIODE; YOUNG MODULUS;

EID: 14844362275     PISSN: 02874547     EISSN: None     Source Type: Journal    
DOI: 10.4012/dmj.23.457     Document Type: Article

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