Dielectric studies of three epoxy resin systems during microwave cure

Polymer

Volumn 46, Issue 8, 2005, Pages 2638-2645

  Zong, Liming ^a   Kempel, Leo C ^a   Hawley, Martin C ^a  

^a Michigan State University   (United States)

Author keywords

Dielectric properties; Epoxy resin; Microwave processing

Indexed keywords

CURING; DIELECTRIC PROPERTIES; MICROWAVES; NATURAL FREQUENCIES; PERMITTIVITY; POLYMERIZATION; RELAXATION PROCESSES; VISCOSITY;

DAVIDSON-COLE MODEL; MICROWAVE CURING; MICROWAVE FREQUENCY;

EPOXY RESINS;

EPOXY RESIN;

ARTICLE; CHEMICAL REACTION; DIELECTRIC CONSTANT; DIFFERENTIAL SCANNING CALORIMETRY; MICROWAVE RADIATION; MOLECULAR MODEL; POLYMERIZATION; TEMPERATURE; VISCOSITY;

NANOCOMPOSITE;

EID: 14844350038     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2005.01.083     Document Type: Article

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