Properties of Sn-Ag-Bi-In solder joints

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 69, Issue 1, 2005, Pages 139-146

  Yamaguchi, Atsushi ^a   Yamashita, Yuhei ^a   Furusawa, Akio ^a   Nishida, Kazuto ^a   Hojo, Takashi ^b,c,d   Sogo, Yosuke ^b   Miwa, Ryoko ^b   Hirose, Akio ^b   Kobayashi, Kojiro F ^b  

^a PANASONIC CORPORATION   (Japan)

^b Graduate School of Engineering   (Japan)

^c OSAKA UNIVERSITY   (Japan)

^d KANSAI ELECTRIC POWER CO   (Japan)

Author keywords

Heat history; High temperature high humidity test; Joint strength; Lead free solder; Melting point; Reflow soldering; Thermal cycle test; Tin silver bismuth indium solder

Indexed keywords

HEAT HISTORY; HIGH HUMIDITY TESTS; JOINT STRENGTH; LEAD-FREE SOLDERS; MELTING POINT; REFLOW SOLDERING; THERMAL CYCLE TESTS; TIN-SILVER-BISMUTH-INDIUM SOLDERS;

ATMOSPHERIC HUMIDITY; EUTECTICS; HIGH TEMPERATURE EFFECTS; MELTING; PRINTED CIRCUIT BOARDS; RELIABILITY; STRENGTH OF MATERIALS; THERMAL CYCLING;

SOLDERED JOINTS;

EID: 14844348469     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.69.139     Document Type: Article

References (14)

1. T. Takemoto: Welding Technique 47(1999) 98-105.
2. K. Fujimoto: J. Japan Inst. Electronics Packaging 3 (2000) 431-434.
3. th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2002) pp. 277-282.
4. th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2002) pp. 295-300.
5. th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2003) pp. 309-314.
6. th Microelec tronics Symposium, (The Japan Welding Society, 2003) pp. 57-60.
7. A. Hirose, T. Fujii and K. F. Kobayashi: Mater. Trans. 42(2001) 794-802.
8. th Pan Pacific Microelectronics symposium, (The Japan Welding Society, 2002) pp. 359-364.
9. th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2000) pp. 211-216.
10. th Microelectronics Symposium, (The Japan Welding Society, 2001) pp. 71-74.
11. th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2002) pp. 345-350.
12. th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2002) pp. 383-388.
13. th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2002) pp. 429-434.
14. M. Hirano, K. Suetsugu, A. Yamaguchi, H. Kuwata, K. Uji and T. Takano: Proc. 5 th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 1999) pp. 393-396.