Improvement of breakdown strength by additives and curing conditions on XLPE insulation for power cable

Conference Record of IEEE International Symposium on Electrical Insulation

Volumn , Issue , 2004, Pages 347-350

  Youn, Bok Hee ^a   Cho, Dae Hee ^a   Shim, Sung Ik ^a  

^a Korea Electric Power Research Institute (KEPRI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; CURING; DIELECTRIC MATERIALS; ELECTRIC BREAKDOWN; ELECTRIC CABLES; ELECTRIC POTENTIAL; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

LAMELLAR STRUCTURES; SEMI-CRYSTALLINE MATERIALS; SEMICONDUCTING INSULATORS; XLPE INSULATION;

ELECTRIC INSULATION;

EID: 14844322841     PISSN: 01642006     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. th ICPADM, Australia, pp. 455-458, 1994
2. Vaughan, A. S. and .Zhao, Y., "On Additives, Morphological Evolution and Dielectric Breakdown in Low Density Polyethylene", European Polymer Journal, Vol. 39, pp. 355-365, 2003.
3. Tanaka, T. and Okamoto, T., "Interfacial Improvement of XLPE Cable Insulation at Reduced Thickness", IEEE Trans. Dielectrics and Electrical Insulation, Vol. 3, No. 3, pp. 345-350, 1996.
4. Gao, L. Y. and Guo, W. Y., "Interfacial Microstrucrure and Withstand Voltage of Polyethylene for Power Cables", IEEE Trans. Dielectrics and Electrical Insulation, Vol. 10, No. 2, pp 233-239, 2003.
5. Hozumi, N. and . Ishida, M. "The Influence of Morphology on Electric Tree Initiation in Polyethylene under ac and Impulse Voltages" IEEE Trans. Electrical Insulation, Vol. 25, No. 4, pp 707-714, 1990.