Generation reason and corrosion characteristic of cavity of tinplate alloy layer

Journal of Central South University of Technology (English Edition)

Volumn 11, Issue 4, 2004, Pages 362-366

  Huang, Jiu Gui ^a,b   Li, Ning ^a   Zhou, De Rui ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b BAOSHAN IRON AND STEEL CO LTD   (China)

Author keywords

Corrosion resistance; Electrochemical atomic force microscope; Glow discharge spectrum; Scanning electron microscopy; Tinplate alloy layer

Indexed keywords

CORROSION RESISTANCE; MORPHOLOGY; PITTING;

BLACK PLATE; CAVITIES; ELECTROTINNING; FOOD PACKAGING MATERIALS; GLOW DISCHARGE SPECTRUM; LOGARITHM LAW; TINPLATE ALLOY LAYER;

CAVITATION CORROSION;

EID: 14744303391     PISSN: 10059784     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11771-004-0075-5     Document Type: Article

References (15)

1. Arenas M A, Conde A, de Damborenea J J. Cerium: a suitable green corrosion inhibitor for tinplate [J]. Corrosion Science, 2002, 44(3): 511-520.
2. Perring L, Basic-Dvorzak M. Determination of total tin in canned food using inductively coupled plasma atomic emission spectroscopy [J]. Analytical and Bioanalysis Chemistry, 2002, 374: 235-243.
3. Carano M. Tin plating [J]. Plating and Surface Finishing, 1998, 85(11): 66-67.
4. Kim T Y, Jin Y S, Kim K Y. The effect of a surface oxide layer of electrolytic tin plate on the frictional properties during the ironing operation of a two-piece can-making process [J]. Surface and Coatings Technology, 1998, 99(3): 319-325.
5. Catald R, Cabanes J M, Bastidas J M. An impedance study on the corrosion properties of lacquered tinplate cans in contact with tuna and mussels in pickled sauce [J]. Corrosion Science, 1998, 40(9): 1455-1467.
6. Lowrev P C. Tinplate: challenges facing the other coated product [J]. American Metal Market, 2000, 108: 16-18.
7. Yfantis D, Yfantis A, Tzalas B, et al. A new, chrome-free passivation method of tinplate used in the canning industry [J]. Corrosion, 2000, 56(7): 700-708.
8. Servais J P, Bastin P, Lamberigts M. New views on the corrosion of tinplate [A]. The Fifth International Tinplate Conference [C]. London, 1992.
9. Lu S F, Mount G R, Mclntyre N S, et al. Use of image depth profiling SIMS for the study of tinplate corrosion [J]. Surface and Interface Analysis, 1994, 21: 177-183.
10. LI Ning, HUANG Jiu-gui, ZHOU De-ri, et al. Finding of gray points on the surface of the Sn-Fe alloy layer and its effects on the corrosion resistance of the alloy layer [J]. J Mater Sci Technol, 2003, 19(2): 174-176.
11. Zumelzu E, Cabezas C. Observations on the influence of microstructure on electrolytic tinplate corrosion [J]. Materials Characterization, 1995, 34: 143-148.
12. Aoki F, Himeno M, Kosumi F, et al. Tin, lead, tin-lead alloy plating [J]. Metal Finishing, 1998, 96(1): 310-319.
13. Ramamurthy S, Walzak T L, Lu S F, et al. Study of tinplate structure using imaging secondary ion mass spectrometry [J]. Surface and Interface Analysis, 1991, 17: 834-841.
14. LI Ning, LI Ping, LI De-yu, et al. Effect of sludge on degree of smudge and corrosion resistance of tinplating [J]. The Chinese Journal of Nonferrous Metals, 2001, 11(5): 930-932. (in Chinese)
15. GONG Xue-nan, WANG Lin, HUANG Bang-lin. Relationship between tinplate ATC value and Sn-Fe alloy layer [J]. Baosteel Technique, 1999, (2): 30-32. (in Chinese)