Effect of fixture compliance on Thermally Enhanced Edge Registration in microlamination

Journal of Manufacturing Science and Engineering

Volumn 126, Issue 4, 2004, Pages 845-848

  Wattanutchariya, Wassanai ^a   Paul, Brian K ^b  

^a CHIANG MAI UNIVERSITY   (Thailand)

^b Oregon State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DIFFUSION; FITS AND TOLERANCES; FUNCTIONS; MATHEMATICAL MODELS; THERMAL EXPANSION; THIN FILMS;

MICROLAMINATION; MONOLITHIC DEVICES; SPECIMENS; THERMAL REGISTRATION;

FIXTURES (TOOLING);

EID: 14744300120     PISSN: 10871357     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1811112     Document Type: Article

References (11)

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