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Volumn 230, Issue 1-4, 2005, Pages 583-588
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The effect of microrelief evolution on the angular dependence of polycrystalline Cu sputtering yield
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Author keywords
Developed surface topography; High dose ion bombardment; Sputtering
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Indexed keywords
COMPUTER SIMULATION;
DOSIMETRY;
EROSION;
GONIOMETERS;
ION BOMBARDMENT;
PHOTOMETRY;
POLYCRYSTALLINE MATERIALS;
SPUTTERING;
SURFACE TOPOGRAPHY;
DEVELOPED SURFACE TOPOGRAPHY;
HIGH-DOSE ION BOMBARDMENT;
LASER GONIOPHOTOMETRY (LGP);
SURFACE RELIEF;
COPPER;
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EID: 14744292900
PISSN: 0168583X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.nimb.2004.12.105 Document Type: Conference Paper |
Times cited : (7)
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References (20)
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