Characterization of various insulators for possible use as low-k dielectrics deposited at temperatures below 200 °c

Microelectronics Reliability

Volumn 45, Issue 5-6, 2005, Pages 990-993

  Vasilopoulou, M ^a   Douvas, A M ^a   Kouvatsos, D ^a   Argitis, P ^a   Davazoglou, D ^a  

^a INSTITUTE OF MICROELECTRONICS   (Greece)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; CURING; DEPOSITION; DIELECTRIC MATERIALS; ELECTRON BEAM LITHOGRAPHY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; LOW TEMPERATURE EFFECTS; MIS DEVICES; PERMITTIVITY; POLYMETHYL METHACRYLATES; STRENGTH OF MATERIALS; SYNTHESIS (CHEMICAL);

CURING TEMPERATURES; FILMTRONICS INC (CO); POLARIZABILITY; SPIN-ON-GLASES (SOG);

ELECTRIC INSULATING MATERIALS;

EID: 14644422660     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.11.009     Document Type: Conference Paper

References (9)

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