Plasma diagnostical comparison of the MSIP process of (Ti,Al)N with pulsed and dc power supplies using energy-resolved mass spectroscopy

Surface and Coatings Technology

Volumn 188-189, Issue 1-3 SPEC.ISS., 2004, Pages 164-167

  Lugscheider, E ^a   Bobzin, K ^a   Papenfuss Janzen N ^a   Maes, M ^a   Parkot, D ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

dc process; MSIP process; Pulsed process

Indexed keywords

IONIZATION; MAGNETRON SPUTTERING; MASS SPECTROMETRY; NITROGEN; PLASMA DIAGNOSTICS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POWER SUPPLY CIRCUITS;

ENERGY-RESOLVED MASS SPECTROSCOPY; ION ENERGY DISTRIBUTIONS; MAGNETRON SPUTTER ION PLATING (MSIP) PROCESSES; NITROGEN FLOW;

TITANIUM COMPOUNDS;

PLASMA TREATMENT;

EID: 14644393657     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2004.08.011     Document Type: Article

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