High electromagnetic shielding of plastic package for 2.5-Gb/s optical transceiver modules

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 1, 2005, Pages 89-95

  Wu, Tzong Lin ^a   Lin, Cheng Wei ^a   Hung, Wen Chi ^a   Lee, Chien Hui ^a   Jou, Wern Shiarng ^b   Cheng, Wood Hi ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

Electromagnetic interference (EMI); Optical packages; Optical transceiver modules; Plastic composites; Plastic packages; Shielding effectiveness (SE)

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; ELECTROMAGNETIC SHIELDING; ELECTROMAGNETIC WAVE INTERFERENCE; EPOXY RESINS; MULTICHIP MODULES; OPTICAL SYSTEMS; PLASTICS APPLICATIONS; TRANSCEIVERS;

OPTICAL TRANSCEIVER MODULES; PLASTIC COMPOSITES; PLASTIC PACKAGE; SHIELDING EFFECTIVENESS (SE);

ELECTRONICS PACKAGING;

EID: 13944261183     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.841667     Document Type: Article

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