Mixed convection of impinging air cooling over heat sink in telecom system application

Journal of Electronic Packaging

Volumn 126, Issue 4, 2004, Pages 519-523

  Bhopte, Siddharth ^a   Alshuqairi, Musa S ^a   Agonafer, Dereje ^a   Refai Ahmed, Gamal ^b  

^a The University of Texas at Arlington   (United States)

^b ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUOYANCY; COOLING; HEAT FLUX; HEAT SINKS; NUSSELT NUMBER; PARTIAL DIFFERENTIAL EQUATIONS; REYNOLDS NUMBER; TELECOMMUNICATION EQUIPMENT; THERMAL CONDUCTIVITY; THERMAL DIFFUSION; THERMAL LOAD; TURBULENT FLOW; VISCOSITY;

AIR FLOW; BUOYANCY FORCES; HEAT SOURCE; RAYLEIGH NUMBER;

HEAT CONVECTION;

EID: 13944260235     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1827267     Document Type: Article

References (12)

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