Mixed convection cooling of horizontally mounted printed circuit board

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 201-208

  Kehoe, E ^a   Davies, M ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

Circuit testing; Cooling; Heat transfer; Power measurement; Printed circuits; Ribs; Temperature measurement; Thermal conductivity; Thermal expansion; Thermal force

Indexed keywords

COOLING; ELECTRIC POWER MEASUREMENT; HEAT TRANSFER; MIXED CONVECTION; OPTICAL DATA PROCESSING; PRANDTL NUMBER; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT TESTING; PRINTED CIRCUITS; REYNOLDS NUMBER; TEMPERATURE MEASUREMENT; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

CIRCUIT TESTING; FUNDAMENTAL MECHANISMS; HEAT TRANSFER MECHANISM; INTERFEROMETRIC IMAGES; OPTICAL MEASUREMENT TECHNIQUES; RIBS; THERMAL FORCES; TWO-DIMENSIONAL APPROXIMATION;

ELECTRONIC COOLING;

EID: 84950107435     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012458     Document Type: Conference Paper

References (21)

1. Lohan, J. M., 'An Investigation into the Thermal Interaction Between Electronic Components on a Printed Circuit Board.' PhD Thesis, University of Limerick, Ireland, 1995.
2. Cole, R., 'Measurement and Prediction of Operational Electronic Component Temperatures.' PhD Thesis, University of Limerick, Ireland, 2001.
3. Dalton, T.M., and Davies, M.R.D., 'An Experimental and Numerical Investigation of Natural Convection Plumes above a Horizontal Cylinder in an Isothermal Cubical Enclosure.' ASME, Heat Transfer Division, Vol. 329, sub - vol. 7, 1996, pp3-10.
4. Newport, D.T., 'Optical Field Measurements of Enclosure Free Convection.' PhD Thesis, University of Limerick, Ireland, 2000.
5. Dalton, T.M., 'On Enclosure Natural Convection for Electronic Cooling Applications.' PhD Thesis, University of Limerick, Ireland, 1996.
6. Wang, Q and Jaluria, Y., 'Instability and Heat Transfer in Mixed Convection Flow in a Horizontal Duct with Discrete Heat Sources.' Proceedings of ASME International Mechanical Engineering Congress and Exposition, November 11-16,New York, 2001.
7. Punch J. and Davies M., 'Still Air Junction to Ambient Thermal Resistance of Different Devices as Functions of the Effective Thermal Conductivity of Printed Circuit Boards.' Proceeding of Eurthothem Seminar, No. 58, Thermal Management of Electronic Systems III, Nantes, France, Sept 1997, pp262-268.
8. Forno, C. and Whelan, M., 'Digital Moiré Subtraction for Eliminating Aberrations in Optical and Engineering Interferometry'. Proceedings of Interferometry 99, SPIE Vol. 3745, Warsaw, October 1999.
9. Forno, C. and Whelan, M., Patent Application no. PCT/GB00/00236 (2000)
10. rd National Heat Transfer Conference, Paper 199, Albuquerque, USA, August 15-17, 1999.
11. Eckert E., R., G. and Soehngen E., 'Distribution of Heat Transfer Coefficients Around Circular Cylinders in Crossflow at Reynolds Numbers from 20 to 500.'Transactions of ASME, April, 1952, pp 343-347.
12. Freymuth, P. and Uberoi, M. S., 'Structure of the Temperature Fluctuations in the Turbulent Wake behind a Heated Cylinder.' Physics of Fluids, Vol. 14, 1971, pp 2574-2580.
13. Rodgers, P., and Davies, M. R.D., 'Air Velocity and Temperature Measurements around a Naturally Convection Rectangular Fin Array.' Thermal Management of Electronic Systems, pp 211-221, Kluwer Academic Publishers, 1994.
14. Raffel, M., Wilert, C. and Kompenhaus, J., 'Particle Image Velocimetry - A Practical Guide.' Springer-Verlag, 1998.
15. Dantec Measurement Technology, "FlowMap Particle Image Velocimetry Instrumentation: Installation & Users Guide", Dantec Measurement Technology, Skovlunde, Denmark, 1998.
16. thTHERMINIC Workshop, Thermal Investigations of ICs and Systems, pp. 23-28, Rome, Italy, September 1999.
17. Oosthuizen, P. H. and Madan, S., "The Effect of Flow Direction on Combined Convective Heat Transfer from Cylinder to Air." ASME Journal of Heat Transfer, Vol. 93, 1971, pp 240-242.
18. Incropera, F. P., 'Fundamental of Heat and Mass Transfer.' 3d ed., John Wiley & Sons, 1990.
19. thNational Heat Transfer Conference, paper NHTC01-1417, Anaheim, California, USA, June 10-12, 2001.
20. Kehoe, E., Grimes, R., and Davies, M., "A Mixed Thermal Convection Criteria for a Printed Circuit Board", Proceedings of the International Mechanical Engineering Congress and Exposition, November 11-16, New York, 2001(a).
21. Grimes, R., Kehoe, E. and Davies, M.R.D., 'A Mixed Convection Criteria for a Printed Circuit Board.' Proceeding of the 7th International Workshop Thermal Investigations if ICs and Systems, September 21-24, Paris, 2001.