Self-aligning planarization and passivation for integration applications in III-V semiconductor devices

IEEE Transactions on Semiconductor Manufacturing

Volumn 18, Issue 1, 2005, Pages 182-188

  Demir, Hilmi Volkan ^a,b   Zheng, Jun Fei ^c   Sabnis, Vijit A ^d   Fidaner, Onur ^a   Hanberg, Jesper ^c   Harris Jr , James S ^a   Miller, David A B ^a  

^a STANFORD UNIVERSITY   (United States)

^b BILKENT UNIVERSITY   (Turkey)

^c INTEL CORPORATION   (United States)

^d Translucent Inc   (United States)

Author keywords

Integrated optoelectronics; Passivation; Semiconductor device manufacturing; Wafer scale integration

Indexed keywords

AROMATIC POLYMERS; DIELECTRIC MATERIALS; ELECTRIC BREAKDOWN; ETCHING; INTEGRATED OPTOELECTRONICS; LEAKAGE CURRENTS; MASKS; OPTICAL SWITCHES; PASSIVATION; PHOTODIODES; WSI CIRCUITS;

BENZOCYCLOBUTENE (BCB) POLYMER; ELECTROABSORPTION; PLANARIZATION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 13844276767     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2004.841834     Document Type: Article

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