Adhesion of electrodeposited copper, nickel and silver films on copper, nickel and silver substrates

Materials Transactions

Volumn 45, Issue 12, 2004, Pages 3330-3333

  Okamoto, Naoki ^a   Wang, Feng ^b   Watanabe, Tohru ^a  

^a TOKYO METROPOLITAN UNIVERSITY   (Japan)

^b SHINSHU UNIVERSITY   (Japan)

Author keywords

Adhesion; Copper; Electrodeposition; Nickel; Silver

Indexed keywords

CRYSTALLOGRAPHIC COHERENCY; FILM DEPOSITION; METAL SUBSTRATES; PLATING BATHS;

ADHESION; COPPER; NICKEL; SCANNING ELECTRON MICROSCOPY; SILVER; SUBSTRATES; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRODEPOSITION;

EID: 13844256492     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.3330     Document Type: Article

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