Rapid thermal bonding of optical fiber interconnect 034903

Journal of Applied Physics

Volumn 97, Issue 3, 2005, Pages

  Bennett, Ted D ^a   Farrelly, Mark B ^a   Pasta, Igor ^b   Poulikakos, D ^b  

^a University of California   (United States)

^b ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING PROCESSES; FRACTURE SUSCEPTIBILITY; PLASTIC STRAIN FIELDS; RAPID THERMAL BONDING; RAPID THERMAL PROCESSING;

CARBON DIOXIDE; FINITE ELEMENT METHOD; GLASS BONDING; INTEGRATION; LASER BEAMS; MATHEMATICAL MODELS; OPTICAL FIBERS; STRENGTH OF MATERIALS; TENSILE STRESS; THERMODYNAMICS;

OPTICAL INTERCONNECTS;

EID: 13644279560     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1845578     Document Type: Article

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