A description of bubble growth and gas release during thermal annealing of helium implanted copper

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Volumn 217, Issue 2, 2004, Pages 276-280

  Evans, J H ^a   Escobar Galindo, R ^b   Van Veen, A ^b  

^a Camrose Consultants   (United Kingdom)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BUBBLE FORMATION; CHEMICAL ANALYSIS; COALESCENCE; COMPUTER SIMULATION; COPPER; DIFFUSION; ELECTROLYTIC POLISHING; HELIUM; PORE SIZE; SCANNING ELECTRON MICROSCOPY; SURFACE PHENOMENA; TRANSMISSION ELECTRON MICROSCOPY;

BUBBLE GROWTH; GAS RELEASE;

ION IMPLANTATION;

EID: 1342304904     PISSN: 0168583X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nimb.2003.10.013     Document Type: Article

References (13)

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