Analysis of dielectric sensors for the cure monitoring of resin matrix composite materials

Sensors and Actuators, B: Chemical

Volumn 30, Issue 2, 1996, Pages 159-164

  Kim, Jin Soo ^a   Lee, Dai Gil ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Cure monitoring; Dielectric sensors; Resin matrix composites

Indexed keywords

CAPACITANCE; COMPOSITE MATERIALS; CURING; DIELECTRIC DEVICES; ELECTRIC FIELD EFFECTS; FINITE ELEMENT METHOD; MONITORING; NETWORKS (CIRCUITS); ONLINE SYSTEMS; SENSITIVITY ANALYSIS;

DIELECTRIC SENSORS; INTERDIGITAL CAPACITOR; RESIN MATRIX COMPOSITES;

SENSORS;

EID: 0029735372     PISSN: 09254005     EISSN: None     Source Type: Journal    
DOI: 10.1016/0925-4005(95)01761-J     Document Type: Article

References (15)

1. W.G. McDonough, B.M. Fanconi, F.I. Mopsik and D.L. Hunston, A role of cure monitoring techniques for on-line process control, Proc. 6th Annual ASM/ESD Advanced Composite Conf., Detroit, MI, USA, 8-11 Oct., 1990, pp. 637-644.
2. D. Hudson, The use of automatic dielectrometry for autoclave moulding of low void composites, Composites, 5 (1974) 247-252.
3. M.L. Bromberg, D.R. Day, H.L. Lee and K.A. Russell, New applications for dielectric monitoring and control, Proc. 2nd Conf. Advanced Composites, Dearborn, MI, USA, 18-20 Nov., 1986, pp. 307-311.
4. D.R. Day, Cure control: strategies for use of dielectric sensors, Proc. 31st Int. SAMPE (Society for the Advancement of Materials and Process Engineering) Symp., 7-10 April, 1986, pp. 1095-1103.
5. P.K. Mallick, Fiber Reinforced Composites, Marcel Dekker, New York, 1988, Ch. 5.
6. H.E. Endres and S. Drost, Optimization of the geometry of gas-sensitive interdigital capacitors, Sensors and Actuators B, 4 (1991) 95-98.
7. M.C. Zaretsky, L. Mouayad and J.R. Melcher, Continuum properties from interdigital electrode dielectrometry, IEEE Trans. Electrical Insul., 23 (1988) 897-917.
8. N.F. Sheppard, Jr., Design of a conductimetric microsensor based on reversibly swelling polymer hydrogels, Proc. 6th Int. Conf., Solid-State Sensors and Actuators (Transducers '91), San Francisco, CA, USA, 24-28 June, 1991, pp. 773-776.
9. N.F. Sheppard, Jr., R.C. Tucker and C. Wu, Electrical conductivity measurements using microfabricated interdigitated electrodes, Anal. Chem., 65 (1993) 1199-1202.
10. J. Lin, S. Möller and E. Obermeier, Two-dimensional and three-dimensional interdigital capacitors as basic elements for chemical sensors, Sensors and Actuators B, 5 (1991) 223-226.
11. J.P. Holman, Heat Transfer, McGraw-Hill, New York, 6th edn., 1986, Ch. 2.
12. D. Halliday and R. Resnick, Fundamentals of Physics, John Wiley, New York, 2nd edn., 1981, Ch. 27.
13. P. Kohnke (ed.), ANSYS User's Manual for Revision 5.0, Swanson Analysis Systems, Inc., Houston, TX, 1992.
14. M.J. Maron, Numerical Analysis, Macmillan, New York, 1982, Ch. 5.
15. R.C. Buchanan, Ceramic Materials for Electronics, Marcel Dekker, New York, 1986, Ch. 1.