Thin-film processing on a thick-film multilayer

Microelectronics International

Volumn 15, Issue 1, 1998, Pages 11-14

  Klink, Gerhard ^a   Drost, Andreas ^a   Schmaus, Christa ^b   Bechtold, Franz ^b   Feil, Michael ^a  

^a Fraunhofer Institut fur Festkorpertechnologie   (Germany)

^b Siegert Electronics GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 13144306139     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565369810199068     Document Type: Article

References (3)

1. Pedersen, U.P.I., Aaserud, O. and Bungum, O.W. (1996), "Combifilm: a novel thick- and thin-film technology for high-speed hybrid circuits", Microelectronics International, Vol. 39, pp. 16-19.
2. Topper, M. (1997), "Dünnfilmmehrlagenverdrahtung mit photosensitivem BCB auf Keramik-, Dickschicht- und LTCC-Substraten", SMT/ES&S/Hybrid, Nuremberg.
3. Tummala, R.T. and Rymaszewski, E.J. (1989), Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, NY.