Combifilm: A novel thick- and thin-film technology with two signal layers for high-speed hybrid circuits

Microelectronics International

Volumn 39, Issue JAN, 1996, Pages 16-19

  Pedersen, U P I ^a   Aaserud, O ^b   Bungum, O W ^c  

^a SINTEF   (Norway)

^b NORWEGIAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Norway)

^c AME   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 2242468394     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Flaten, B.-E., Grønli, H. B. and Bungum, O. W., 'Combifilm Hybrids (CFH) for High Performance Muitichip Modules', Proceedings International Electronics Packaging Conference, San Diego, California, Vol. 1, pp. 49-57 (1991).
2. Parasitic Parameters Tutorial and Technical Manual Version 3, Pacific Numerix Corporation, La Jolla, California (1991) revised 11/ 4-92.
3. Sæther, O., Flaten, B.-E. and Aaserud, O., 'A Closed Form Expression for the AC Resistance in Microstrip Lines', to be published.
4. Wheeler, H. A., 'Transmission-Line Properties of a Strip on a Dielectric Sheet on a Plane', IEEE Transactions on Microwave Theory and Techniques, Vol. MTT-25, No. 8, pp. 631-647, August (1977).
5. Bakoglu, H. B., 'Circuits, Interconnections, and Packaging for VLSI', Addison-Wesley Publishing Company (1990).
6. Pedersen, U. P. I., Aaserud, O. and Bungum, O. W., 'System Modelling of Combifilm: A Novel Thick- and Thin-Film Technology for High-Speed Applications', Proceedings ICECS '94 Conference, Cairo (1994).
7. Pedersen, U. P. I., 'Process Development and System Modelling of a Combined Thick and Thin Film Hybrid Technology for High-Speed Applications', Dr Ing, thesis at The Norwegian Institute of Technology, Department of Physical Electronics, FYS, EL.-rapport 1994:08 (1994).