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Volumn 17, Issue 4, 2004, Pages 537-542

TDFAD approach to high temperature defect assessment and its engineering application

Author keywords

Creep; Defective structure; High temperature; Safety assessment; Time dependent failure assessment diagram

Indexed keywords

CRACK PROPAGATION; CREEP; FAILURE (MECHANICAL); STRAIN; STRESS INTENSITY FACTORS; STRESSES; STRUCTURAL ANALYSIS;

EID: 12444293925     PISSN: 10009345     EISSN: None     Source Type: Journal    
DOI: 10.3901/cjme.2004.04.537     Document Type: Article
Times cited : (8)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.