Is your solder paste

SMT Surface Mount Technology Magazine

Volumn 10, Issue 7, 1996, Pages 42-45

  Austin, Eric L ^a   Lewis, Alan R ^a  

^a Asymtek Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 7044271027     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. J.S. Hwang, Solder Paste in Electronics Packaging, Van Nostrand Reinhold New York, 1989.
2. J.H. Lau, Ball Grid Array Technology, McGraw-Hill, 1995.
3. A.J. Babiarz, "Solder Paste Dispensing Test - Part III," Surface Mount Technology, July 1990.
4. A.R. Lewis and E.L. Austin, "Test Standard: Choice of Sample Size for Experiments," (draft), January 1996.
5. P.E. Waitkus and K.W. Gaugler, "Fine-Pitch Solder Paste Dispensing," Circuts Assembly, November 1994.