Finite element parametric analysis on fine-pitch BGA (FBGA) packages

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 933-939

  Chong, Desmond Y R ^a   Wang, C K ^a   Fong, K C ^a   Lall, Pradeep ^b  

^a United Test and Assembly Center Ltd   (Singapore)

^b AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COOLING; ENCAPSULATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONIC PROCESSING; PARAMETER ESTIMATION; THERMAL STRESS; VISCOELASTICITY; CHIP SCALE PACKAGES; DIES; ELECTRONIC EQUIPMENT MANUFACTURE;

DIE STRESSES; FINE-PITCH BGA (FBGA) PACKAGES; CELLULAR PHONE; DIE CRACKING; DIE CRACKS; DIE SIZE; DIE STRESS; FINITE ELEMENT; IC PACKAGE; INTEGRATED CIRCUIT PACKAGE; PARAMETRIC ANALYSIS; PORTABLE PRODUCTS; SUBSTRATE THICKNESS; SURFACE MOUNTING; WARPAGES;

ELECTRONICS PACKAGING; PACKAGING;

EID: 1242331957     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35335     Document Type: Conference Paper

References (5)

1. JEDEC Standard SPP-017 Rev B, Dec 1999.
2. G. Kelly et. al., "Importance of Molding Compound Chemical Shrinkage in the Stress and Warpage Analysis of PQFP's", IEEE Trans. on CPMT, vol. 19, no. 2, pp. 296-300, May 1996.
3. th ECTC Proc., pp. 102-106, 1994.
4. T.Y Tee et. al., "Warpage Analysis and Viscoelastic Modeling of Block BGA", InterPack Conference Proc., Doc No. 15726, USA, 2001.
5. N. Srikanth et. al., "Warpage Analysis of Plastic Packages Using Viscoelastic Based Model", APACK Symposium on Advances in Packaging, Singapore, pp. 468-476, 1999.