Underfilling Micro-BGAs

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4217, Issue , 2002, Pages 134-140

  Peng, Haiwei ^a   Johnson, R Wayne ^a   Yeager, Erin ^a   Konarski, Mark ^a   Torres, Afranio ^a   Flowers, George ^a   Crane, Larry ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; FILLERS; FLOW OF SOLIDS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; SHOCK TESTING; SUBSTRATES; THERMOSETS;

LIQUID-TO-LIQUID THERMAL SHOCK; MICRO-BALL GRID ARRAYS; SNAP CURE UNDERFILL; THERMALLY REWORKABLE UNDERFILL;

CHIP SCALE PACKAGES;

EID: 0036386864     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Peter Elenius and Hong Yang, "The Ultra CSP™ Wafer Scale Package," High Density Interconnect Conference and Expo, Tempe, AZ, September 15-16, 1998
2. Steven J. Young, "Underfilling BGA and CSP for Harsh Environment Deployment," Proceedings of the 1999 International Conference on High Density Packaging and MCMs, Denver, CO, April 7-9, 1999.
3. Bruce Houghton, "Solving the ENIG Black Pad Problem: An ITRI Report on Round 2," Proceedings of IPC Works '99, Oct. 23-28, 1999, Minneapolis, MN, pp. S-04-3-1 to S-04-3-9.