Smart cooling of data centers

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 129-137

  Patel, Chandrakant D ^a   Bash, Cullen E ^a   Sharma, Ratnesh ^a   Beitelmal, Monem ^a   Friedrich, Rich ^a  

^a HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

Computer room air conditioning; Cooling; Data center; High power data center; Power; Smart cooling

Indexed keywords

AIR CONDITIONING; ALGORITHMS; BOUNDARY CONDITIONS; COMPUTER CONTROL; DECISION MAKING; ENERGY MANAGEMENT; FEEDBACK CONTROL; FLOW INTERACTIONS; OPTIMIZATION; SERVERS; TEMPERATURE DISTRIBUTION; THERMAL LOAD; COOLING; COOLING SYSTEMS; DISTRIBUTED PARAMETER CONTROL SYSTEMS; ELECTRONICS PACKAGING; TEMPERATURE MEASUREMENT; THERMOELECTRIC EQUIPMENT;

COMPUTER ROOM AIR CONDITIONING (CRAC); THERMAL FLUIDS; COMPUTER ROOM AIR CONDITIONING; DATA CENTER; HIGH-POWER; POWER; SMART COOLING;

COOLING SYSTEMS; SATELLITE COMMUNICATION SYSTEMS;

EID: 1242287075     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35059     Document Type: Conference Paper

References (16)

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