Drop reliability of corner bonded CSP in portable products

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 897-905

  Tian, Guoyun ^a   Liu, Yueli ^a   Lall, Pradeep ^a   Wayne Johnson, R ^a   Abderrahman, Sanan ^a   Palmer, Mike ^a   Islam, Nokib ^a   Suhling, Jeffrey ^a   Crane, Larry ^b  

^a AUBURN UNIVERSITY   (United States)

^b Henkel Loctite Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FLOW; FAILURE ANALYSIS; FINITE ELEMENT METHOD; MAN MACHINE SYSTEMS; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RELIABILITY; STRENGTH OF MATERIALS; BLOOD VESSELS; CURING; DEHYDRATION; DEWATERING; ELECTRONICS PACKAGING;

CAPILLARY FORCES; ASSEMBLY PROCESS; CORNER BONDING; DISPENSE VOLUMES; DROP TEST; FINITE ELEMENT MODELING; MANUFACTURING PROCESS; MECHANICAL COUPLING; MECHANICAL RELIABILITY; MECHANICAL SHOCK; MECHANICAL STRENGTH; PORTABLE ELECTRONICS; PORTABLE PRODUCTS; SMALL AREA; SOLDER PASTE PRINT; TEST RESULTS; THERMAL CYCLE; UNDERFILLS;

ELECTRONICS PACKAGING; DROPS;

EID: 1242264454     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35318     Document Type: Conference Paper

References (9)

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7. Loctite 3515 Datasheet www.loctite.com/datasheets/tds/Product_3515.pdf
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