Acoustic compression for the thermal management of multi-load electronic systems

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 395-402

  Bash, C E ^a   Patel, C D ^a   Beitelmal, A ^a   Burr, Ronald F ^b  

^a HEWLETT PACKARD LABORATORIES   (United States)

^b MacroSonix Corporation   (United States)

Author keywords

Central Processing Unit; Cooling; Heat sinks; Microprocessors; Power dissipation; Refrigeration; Temperature; Thermal conductivity; Thermal management; Thermal management of electronics

Indexed keywords

COOLING; ELECTRONIC COOLING; ENERGY DISSIPATION; HEAT SINKS; MICROPROCESSOR CHIPS; PROGRAM PROCESSORS; REFRIGERATION; TEMPERATURE; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL VARIABLES CONTROL;

DEW POINTS; ELECTRONIC SYSTEMS; ITS APPLICATIONS; MANAGEMENT ARCHITECTURES; OIL-LESS; REFRIGERATION SYSTEM;

VAPOR COMPRESSION REFRIGERATION;

EID: 84950142745     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012483     Document Type: Conference Paper

References (8)

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2. Patel C. D., 1994, "Backside Cooling Solution for High Power Flip Chip Multi-chip Modules," 44th IEEE Proceedings, May1994, pp 442-449.
3. Bash, C. B., 2001, "Analysis of Refrigerated Loops for Electronics Cooling", IPACK, July 2001, Kauai, HI.
4. Schmidt, R., 2000, "Low Temperature Electronic Cooling", Electronics Cooling, 6, No. 3, pp. 18-24.
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6. Ilinskii, Y. A., B. Lipkens, T. S. Lucas, T. W. Van Doren, and E. A. Zabolotskaya, 1998, "Nonlinear standing waves in an acoustical resonator," J. Acoust. Soc. Am. 104, 2664-2674.
7. Bash, C.B., 2000, "A Hybrid Approach to Plate Fin-Tube Heat Exchanger Analysis", Proceedings of the International Conference and Exhibition on High Density Interconnect and Systems Packaging, Denver, CO, April 25-28, pp. 40-48.
8. Carey, V. P., Liquid-Vapor Phase-Change Phenomena, Taylor and Francsis, 1992.