Optimization of Elliptical Fin Heat Sink Design in Forced Convection: Single and Multiple Heat Sink Scenarios

Advances in Electronic Packaging

Volumn 2, Issue , 2003, Pages 89-96

  Kadangode, Subha M ^a   Mason, John R ^b  

^a Intricast   (United States)

^b CISCO SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTATIONAL FLUID DYNAMICS; COMPUTATIONAL GEOMETRY; COMPUTER SIMULATION; COMPUTER SOFTWARE; FORCED CONVECTION; HEAT CONDUCTION; HEAT FLUX; HEAT RESISTANCE; OPTIMIZATION; PRESSURE DROP; THICKNESS MEASUREMENT; VELOCITY MEASUREMENT; ELECTRONICS PACKAGING;

AIR FLOW; FLOW VELOCITY MEASUREMENT; AIR VELOCITIES; ELLIPTICAL FINS; FIN GEOMETRY; FIN HEAT SINKS; FIN HEIGHT; FIN LENGTH; GAP WIDTHS; HEAT SINK DESIGN; IMPEDANCE CHARACTERISTICS; IN-LINE; PIN FIN HEAT SINKS; THERMAL PERFORMANCE; USER REQUIREMENTS;

FINS (HEAT EXCHANGE);

EID: 1242264424     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2003-35029     Document Type: Conference Paper

References (2)

1. H. Shaukatullah: "Bibliography of Air Cooled Heat sinks for Thermal Enhancement of Electronic Packages" Proceedings of Fourteenth IEEE Semi-Therm Symposium, pp. 177-181, San Diego, CA, March 10-12, 1998.
2. C. Chapman: "Thermal Performance of an Elliptical Pin Fin Heat sink" Proceedings of Tenth IEEE Semi-Therm Symposium, pp. 24-31, San Jose, CA, February 1-3, 1994.