Trade-off design of extruded heat sinks using mathematical optimization

Journal of Electronic Packaging

Volumn 126, Issue 3, 2004, Pages 333-341

  De Kock, D J ^a   Visser, J A ^a  

^a UNIVERSITY OF PRETORIA   (South Africa)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; EXTRUSION; HEAT RESISTANCE; OPTIMIZATION;

HEAT SOURCE; PARETO-OPTIMAL SET; THERMAL SIMULATION; TRADE-OFF DESIGN;

HEAT SINKS;

EID: 12344275610     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1772414     Document Type: Article

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