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Volumn 274, Issue 3-4, 2005, Pages 622-631
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The influence of the alumina barrier-layer thickness on the subsequent AC growth of copper nanowires
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Author keywords
A1. Alumina; A1. Interfaces; A2. Electrochemical growth; B1. Nanomaterials
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Indexed keywords
ANNODIZATION;
CONDUCTING POLYMERS;
COPPER NANOWIRES;
ELECTROCHEMICAL GROWTH;
ALUMINA;
ANNEALING;
COPPER;
DEPOSITION;
ELECTRIC IMPEDANCE;
ELECTRIC POTENTIAL;
ELECTROCHEMISTRY;
ELECTROLYSIS;
GROWTH (MATERIALS);
INTERFACES (MATERIALS);
SCANNING ELECTRON MICROSCOPY;
SPECTROSCOPIC ANALYSIS;
NANOSTRUCTURED MATERIALS;
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EID: 12244299887
PISSN: 00220248
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jcrysgro.2004.10.021 Document Type: Article |
Times cited : (32)
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References (24)
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