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Volumn 274, Issue 3-4, 2005, Pages 622-631

The influence of the alumina barrier-layer thickness on the subsequent AC growth of copper nanowires

Author keywords

A1. Alumina; A1. Interfaces; A2. Electrochemical growth; B1. Nanomaterials

Indexed keywords

ANNODIZATION; CONDUCTING POLYMERS; COPPER NANOWIRES; ELECTROCHEMICAL GROWTH;

EID: 12244299887     PISSN: 00220248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jcrysgro.2004.10.021     Document Type: Article
Times cited : (32)

References (24)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.