Research on thermal performance of plate-pin fin heat sink

Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University

Volumn 38, Issue 11, 2004, Pages 1114-1118

  Yu, Xiaoling ^a   Feng, Quanke ^a   Feng, Jianmei ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Electronic device cooling; Heat sink; Heat transfer

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; COOLING SYSTEMS; HEAT TRANSFER; NUSSELT NUMBER; TURBULENT FLOW;

AIR COOLING; ELECTRONIC DEVICE COOLING; PLATE PIN FIN HEAT SINK; TURBULENT MODEL;

HEAT SINKS;

EID: 11444262927     PISSN: 0253987X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

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6. Sparrow E M, Ramsey J W, Altemani C A C. Experiments on in-line pin fin arrays and performance comparisons with staggered arrays [J]. ASME Journal of Heat Transfer, 1980, 102(2): 44-50.