Interfacial fracture toughness measurement for thin film interfaces

Engineering Fracture Mechanics

Volumn 71, Issue 9-10, 2004, Pages 1219-1234

  Modi, Mitul B ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Decohesion test; Interfacial fracture toughness; MEMS; Microelectronics; Thin films

Indexed keywords

DEFORMATION; DELAMINATION; ELASTICITY; FRACTURE TOUGHNESS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; STRESS ANALYSIS; THIN FILMS;

DECOHESION TESTS; INTERFACIAL FRACTURE TOUGHNESS;

INTERFACES (MATERIALS);

ELECTRONICS INDUSTRY; FRACTURE TOUGHNESS;

EID: 1142293210     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-7944(03)00210-8     Document Type: Article

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