Ceramics bonding using solder glass frit

Journal of Electronic Materials

Volumn 33, Issue 12, 2004, Pages 1516-1523

  Sun, Z ^a   Pan, D ^a   Wei, J ^a   Wong, C K ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Bonding; Ceramics; Processing parameters; Solder glass frit; Surface roughness; Surface treatment; Surface contact angle

Indexed keywords

ALUMINA; BONDING; GLASS; MELTING; SOLDERING; SURFACE ROUGHNESS; SURFACE TREATMENT; VISCOSITY;

BONDING STRENGTH; PROCESSING PARAMETERS; SOLDER GLASS FRIT; SURFACE-CONTACT ANGLE;

CERAMIC MATERIALS;

EID: 11344276660     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0093-y     Document Type: Conference Paper

References (18)

1. M.W. Barsoum, Fundamentals of Ceramics (New York: McGraw-Hill, 1997), pp. 291-330.
2. R.E. Smallman and R.J. Bishop, Modern Physical Metallurgy and Materials Engineering, Science, Process, Applications (Oxford: Butterworth-Heinemann, 1999), pp. 320-350.
3. W.F. Smith, Principles of Materials Science and Engineering (New York: McGraw-Hill, 1996), pp. 581-657.
4. M.P. Groover, Fundamentals of Modern Manufacturing Materials, Processes, and Systems (Upper Saddle River, NJ: Prentice-Hall, 1996), pp. 162-182.
5. R.W. Messler, Jr., Joining of Advanced Materials (Boston: Butterworth-Heinemann, 1993), pp. 431-456.
6. M.M. Schwartz, Ceramic Joining (Materials Park, OH: ASM International, 1990), pp. 17-40, 45-145.
7. SCHOTT AG, www.schott.com/english/index.html.
8. L.P. Connor, R.L. O'Brien, and W.R. Oates, Welding Handbook, vol. 3, Materials and Applications, 8th ed. (Miami, FL: AMS, 1998).
9. Greg Geiger, Am. Ceramic Soc. Bull. 69, 5 (1990).
10. T.H. North, Proc. International Institute of Welding Congress on Joining Research (New York: Chapman Hall, 1990).
11. G. Wallis, J. Dorsey, and D. Pomerantz, Welding J. 49, 852 (1970).
12. V. Dragoi, M. Alexe, M. Reiche, and U. Goesele, Proc. Int. Semiconductor Conf. (Piscataway, NJ: IEEE, 1999), pp. 443-446.
13. M. Esashi, A. Nakano, S. Shoji, and H. Hebiguchi, Proc. 5th Int. Conf. on Solid-State Sensors and Actuators and Eurosensors (Lausanne, Switzerland: COMST, 1989), pp. 931-934.
14. W.H. Ko, J.T. Suminto, and G.J. Yeh, Proc. Micromachining and Micropackaging of Transducers (New York: Elsevier, 1985), pp. 41-61.
15. B.C. James and D.J. Kilpatrick, TWI J. 5, 349 (1996).
16. I.A. Bucklow, TWI J. 2, 128 (1993).
17. L.A. Field and R.S. Muller, Proc. 5th Int. Conf. on Solid-State Sensors and Actuators and Eurosensors (Lausanne, Switzerland: COMST, 1989), pp. 935-938.
18. Z. Sun, D. Pan, J. Wei, and C.K. Wong, "Development of Bonding Processes for Joining Glasses, Ceramics and Metals," Project Report C01-P-146AR (Singapore: Singapore Institute of Manufacturing Technology, 2003).