A chip-level process for power switching module integration and packaging

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 3, Issue , 2004, Pages 1932-1939

  Liang, Zhenxian ^a   Van Wyk, J D ^a   Lee, Fred C ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

Integration and Packaging Technology; Power Semiconductor Module

Indexed keywords

BALL GRID ARRAY (BGA); INTEGRATION AND PACKAGING TECHNOLOGY; MULTICHIP MODULES (MCMS); POWER SEMICONDUCTOR MODULE;

AUTOMATION; CAPACITORS; CONTROL EQUIPMENT; COOLING; ELECTRODES; METALLIZING; MICROELECTRONICS; POWER ELECTRONICS; POWER INTEGRATED CIRCUITS; RELIABILITY; SENSORS;

SWITCHING SYSTEMS;

EID: 10944269431     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IAS.2004.1348733     Document Type: Conference Paper

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