메뉴 건너뛰기




Volumn 151, Issue 12, 2004, Pages

Self-conditioning fixed abrasive pad in CMP

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; CATALYSTS; DEFORMATION; ELASTICITY; HYDROPHILICITY; OXIDATION; POLYMERS; SURFACE PROPERTIES; SWELLING;

EID: 10844272437     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1813951     Document Type: Article
Times cited : (55)

References (11)
  • 4
    • 10844241196 scopus 로고    scopus 로고
    • Y. A. Arimoto, R. L. Opila, C. Reidsema Simpson, K. B. Sundaram, I. Ali, and Y. Homma, Editors, PV 99-37, The Electrochemical Society Proceedings Series, Pennington, NJ
    • D. A. Hansen, G. Moloney, and M. E. Witty, in Chemical Mechanical Planariza tion in IC Device Manufacturing III, Y. A. Arimoto, R. L. Opila, C. Reidsema Simpson, K. B. Sundaram, I. Ali, and Y. Homma, Editors, PV 99-37, p. 136, The Electrochemical Society Proceedings Series, Pennington, NJ (1999).
    • (1999) Chemical Mechanical Planariza Tion in IC Device Manufacturing III , pp. 136
    • Hansen, D.A.1    Moloney, G.2    Witty, M.E.3
  • 11
    • 10844223323 scopus 로고    scopus 로고
    • Korea Pat. 2001-0035669 and 2001-0037315
    • J. Lee, Korea Pat. 2001-0035669 and 2001-0037315.
    • Lee, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.