Design and analysis of embedded inductor on low cost multilayer laminate MCM technology

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 83-86

  Lee, Ryan C ^a   Lee, Gye An ^b   Megahed, Mohamed ^a  

^a SKYWORKS SOLUTIONS INC   (United States)

^b University of California at Irvine   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; INDUCTANCE; MULTILAYERS;

ANALYTICAL EQUATIONS; DESIGN AND ANALYSIS; DIELECTRIC STACK; EMBEDDED INDUCTORS; INDUCTANCE VARIATION; LAMINATE SUBSTRATES; PHYSICAL PARAMETERS; PROCESS VARIATION;

COST BENEFIT ANALYSIS;

EID: 23144435677     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250005     Document Type: Conference Paper

References (7)

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2. A. Sutono, D. Heo, Y. E. Chen, and J. Laskar, "High-Q LTCC-Based Passvie Libiaiy for Wireless System-on-package (SOP) Module Development" IEEE Trans. Microwave Theory Tech. vol. 49, pp. 1715-1724, Oct. 2001.
3. S. Dalmia, W. Kim, S. H. Min, M. Swaminathan, V. Sundaraman, F. Liu, G. White, and R. Tumntala, "Design of Embedded High Q-Inductors In MCM-L Technology, " IEEE Microwave Syposium Dig., vol. 3. pp. 1735-1738, 2001.
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7. Advanced Design System User's Manual, Desember 2000, Agilent Technologies.