Sampling and reference considerations for very high resolution AFM analysis

Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004

Volumn , Issue , 2004, Pages 357-362

  Gondran, Carolyn F H ^a   Michelson, Diane K ^b  

^a Advanced Technology Development Facility   (United States)

^b SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COMPUTATIONAL GEOMETRY; COMPUTER SIMULATION; MATHEMATICAL MODELS; MOSFET DEVICES; SILICON WAFERS; SUBSTRATES;

MULTIPLE-GATE FIELD EFFECT TRANSISTORS (MUGFET); POWER SPECTRAL DENSITY (PSD); SIDEWALL ROUGHNESS MEASUREMENTS; SURFACE MICRO-ROUGHNESS;

ATOMIC FORCE MICROSCOPY;

EID: 10444278209     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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6. Krivokapic, Z. et al., Extended Abstracts of the International Conference on Solid State Devices and Materials, SSDM, (2003) pp. 760-762
7. Gondran, C.F.H. et al., Mat. Res. Soc. Symp. Proc., vol. 811, (2004) E1.13
8. 2003 International Technology Roadmap for Semiconductors, Front End Processes, Surface Prep, footnote J, p. 20
9. NIST/SEMATECH e-Handbook of Statistical Methods, http://www.itl.nist.gov/div898/handbook/, 2004