Hygro-thermo-mechanical behavior of molding compounds at elevated environments

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 180-185

  Yi, Sung ^a   Yu, Zeyan ^a   Neo, Raynard ^a,c   Lee, Yeong J ^b  

^a Department of Electrical and Computer Engineering   (United States)

^b DOW CHEMICAL COMPANY   (United States)

^c Micron   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY-BASED POLYMERS; HYGRO-THERMO-MECHANICAL BEHAVIOR; POLYMER MOLDING COMPOUNDS;

CREEP; EPOXY RESINS; INTEGRATED CIRCUITS; MOISTURE; POLYMERS; RELIABILITY; RESIDUAL STRESSES; THERMOMECHANICAL TREATMENT; VISCOELASTICITY;

ELECTRONICS PACKAGING;

EID: 10444255421     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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