Router flip chip packaging solution and reliability

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 1153-1160

  Tosaya, Eric ^a   Ouimet, Sylvain ^b   Martel, Robert ^b   Lord, Raymond ^b  

^a Procket Networks Inc   (United States)

^b IBM CANADA LTD   (Canada)

Author keywords

CCGA; Column Grid Array; HiTCE

Indexed keywords

BANDWIDTH; COMPUTER SIMULATION; DATA PROCESSING; FLIP CHIP DEVICES; RELIABILITY; VLSI CIRCUITS;

CCGA; COLUMN GRID ARRAY; HITCE; SWITCH CARD (SC);

ROUTERS;

EID: 10444251708     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. th Electronic components and technology Conference, 1995, IEEE, Piscataway, NJ, pp. 925-929.
2. th Electronic components and technology Conference, 1997, IEEE, Piscataway, NJ, pp. 319-324.
3. Ray, S et al, "CLASP Ceramic Column Grid Array Technology for Flip Chip Carriers" Proceeding of Semicon West, 7/99, San Jose.
4. Marie S. Cole, Eric J. Kastberg and Gregory B. Martin, "Shock and Vibration Limits for CBGA and CCGA", IBM Microelectronics.