Lead-free solder interconnect by variable frequency microwave (VFM)

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1989-1995

  Moon, Kyoung Sik ^a   Li, Yi ^a   Xu, Jianwen ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ORGANIC FLUX; SOLDER INTERCONNECTION; TEMPERATURE GRADIENT; VARIABLE FREQUENCY MICROWAVE (VFM);

ENERGY DISPERSIVE SPECTROSCOPY; GRAIN SIZE AND SHAPE; INTERMETALLICS; MICROSTRUCTURE; MICROWAVE HEATING; MICROWAVES; POLYMERS; PRINTED CIRCUIT BOARDS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMOANALYSIS;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 10444249584     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. J.H. Lau, Solder Reliability-Theory and Application, New York: Van Nostrand Reinhold, 1991.
2. P.T. Vianco, K.L. Erickson, P.L. Hopkins, Solid-state intermetallic compound growth between copper and high temperature, tin-rich solders, I. Experimental analysis. II. Modeling. J. Electron. Mater., 27, 1154 (1994).
3. W. Yang, Jr. W. Messler, L. Felton, Microstructure evolution of eutectic Sn-Ag solder joints, J. Electron. Mater, 23, 765 (1994).
4. G.Y. Li and B.L. Chen, Formation and growth kinetics of interfacial intermetallics in Pb-free solder joint, IEEE Trans. Comp. Packag. Technol. 26. 651 (2003).
5. K.S. Kim, S.H. Huh and K. Suganuma, Effects of intermetallic compounds on properties of Sn-Ag-Cu lead free solders, J. Alloys and Compounds, 352, 226 (2003).
6. K. Suganuma, Advances in lead-free electronics soldering, Current Opinion in Solid State and Material Science, 5, 55 (2001).