Stress relaxation and creep of 12 to 35 μm copper foil

Journal of Electronic Materials

Volumn 26, Issue 7, 1997, Pages 833-838

  Merchant, H D ^a  

^a Gould Electronics   (United States)

Author keywords

Copper; Creep; Electrodeposit; Foil; Stress relaxation

Indexed keywords

CREEP; DEFECTS; ELECTRODEPOSITION; EMBRITTLEMENT; GRAIN SIZE AND SHAPE; METAL FOIL; NUCLEATION; STIFFNESS; STRESS RELAXATION; SUBSTRATES; YIELD STRESS;

NON EQUILIBRIUM DEFECT STRUCTURE; ROLLED COPPER FOILS;

COPPER;

EID: 0031192034     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-997-0259-5     Document Type: Article

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